APA:
Liu, Keh-Fei, Wu, Mingfang, Pu, Juan (2017). Formation mechanism of diffusion-reaction layer for a Cu/Ti diffusion couple under different heating methods.
Materiali in tehnologije, volume 51, issue 6, str. 1025-1029.
URN:NBN:SI:DOC-KTMDDPES from http://www.dlib.si
MLA:
Liu, Keh-Fei, Wu, Mingfang, Pu, Juan. "Formation mechanism of diffusion-reaction layer for a Cu/Ti diffusion couple under different heating methods."
Materiali in tehnologije volume 51. issue 6 (2017) str. 1025-1029.
<http://www.dlib.si/?URN=URN:NBN:SI:DOC-KTMDDPES>